On 5th June, 2012 Intel release their brand Ultrabook in India. The Ultrabook contains a 3G core processor which is constructed of the most developed 22 nanometer 3D tri-gate transistor. What’s about the 22 nanometer 3D tri-gate transistor? Let me know in detail about the transistor.
On may 4, 2011 what Intel announced is called a major technical breakthrough and historic innovation in microprocessing. The world’s first 3D transistor called Tri-Gate in mass production will effect in both performance and power enhancements in 22-nanometer “ivy bridge” chip. The transition of 3D persists the rapidity of technology advancement, fueling moore’s law for years to come. The 3D Tri-Gate technology will far exceed the low-voltage(37% performance increase at low-voltage) and low-power(50% power reduction at constant performance) benefits, switching characteristics, what we typically see from one process generation to the next. Product designers will be given the elasticity to make devices smarter and new ones possible.
Tri-Gate transistors have a lifted plateau-like gate structure with two vertical walls and a horizontal wall of gate electrode. This 3D structure improves drive current while the depleted substrate reduces leakage current when the transistor is in the “off” state. Reducing leakage control translates to increased battery life in mobile devices as well as helps control heat at the circuit level.
